CBT 6000 high speed, large area, thermosonic ball bonder conducts measurements of wire bonding productivity...
CBT 6000 high speed, large area, thermosonic ball bonder conducts measurements of wire bonding productivity. The true measure of productivity is net throughput. By utilizing the bonder's large work area, 152mm x 304mm (6 in. x 12 in.), this series handling systems eliminates indexing time, creating a unique non-stop bonding platform. The large platform accommodates parts of all sizes, allowing for design flexibility.
This ultra fast, accurate bonding technology is ideal for a wide variety of applications, including large complex hybrids and multichip modules (MCMs), display panels, automotive assemblies, disk drive assemblies, flex circuits, chip on board (COB), specialty leadframes, fine pitch, and IC devices.
Customer service assistance in evaluating proposed applications is available.
Palomar Technologies, 2230 Oak Ridge Way, Vista, CA 92083-8341. Tel: 760-931-3600; Fax: 760-931-5191.