Power Module Baseplates

These power module baseplates are designed to provide superior reliability and durability. Custom manufactured, these components meet the specific needs of ceramic-to-metal seal assembly technology.

Constructed from OFHC copper which is bonded directly to non-toxic aluminum nitride, power module baseplates feature high dielectric strength and provide excellent thermal conductivity properties. The high temperature brazing process produces an active metal seal with high bond strength. The component also maintains a low coefficient of thermal expansion, similar to silicon.

Designs are customizable to specific applications, with copper thickness ranging from 0.005 to 0.020 inches.

Aluminum Oxide substrates are also available to supplement the aluminum nitride if necessary.

Alberox Corporation, 225 Theodore Rice Blvd., New Bedford, MA 02745-1289. Tel: 508-995-1725; Fax: 508-995-6954.